The 14th Semiconductor Equipment, Materials and Core Parts Exhibition（CSEAC2026）
2026 CSEAC: The 14th Semiconductor Equipment, Materials & Core Components Exhibition
CHIAN SENG (正河源) is proud to debut at CSEAC 2026, focusing on Semiconductor Core Components and Precision Machining Solutions. We will showcase a series of R&D technical solutions specifically designed for the semiconductor supply chain.
● Exhibition Highlights & Cutting Tool Technology:
- High-Precision Cutting Tool Series: Specialized end mills and drilling tools for semiconductor precision parts. Featuring optimized flute geometry and advanced coating technology to eliminate built-up edges (BUE) and ensure dimensional stability during long machining cycles.
- Specialized Tool Holders & High-Performance Chuck Systems: Stability starts with secure clamping. Our precision tool holder systems offer superior vibration damping and repeatability, significantly extending tool life and protecting high-value semiconductor components.
- Comprehensive Precision Machining Solutions: Beyond products, we offer "Process Optimization Services." Our technical team will provide 1-on-1 consultations to assist with tool selection, parameter tuning, and digital workflow upgrades.